DRY FILM LAMINATOR:

Dry film process is recommended for image transfer in Printed Circuit Board fabrication process. Dry Film Laminator is needed to stick the dry film onto the PCB. The laminator removes  the protectivepolyethylene film from the dry film during lamination.The photopolymerization characteristic and the convenience of dry film photo resist make it useful for image transfer. Dry film normally gives a best  result  in fabrication of PCBs.After laminating board with photosensitive  dry film ,film master is exposed with UV light source and developed to get required image .

PICK AND PLACE MACHINE:SMT (surface mount technology) component placement systems, commonly called pick-and-place machines or P&Ps, are manual assisted or robotic machines which are used to place surface-mount devices (SMDs) onto a printed circuit board (PCB).

REFLOW OVEN:

Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach one or several electrical components to their contact pads, after which the entire assembly is subjected to controlled heat, which melts the solder, permanently connecting the joint.The goal of the reflow process is to melt the solder and heat the adjoining surfaces, without overheating and damaging the electrical components. In the conventional reflow soldering process, there are usually four stages, called "zones", each having a distinct thermal profile: preheat, thermal soak (often shortened to just soak), reflow, and cooling.