Electronics and Hardware Industry is increasingly finding applications in all sectors of the economy and thus is accepted as a key enabler in development of our country. The current growth trend and its existing contribution to the global electronics industry indicates that the share of IT Hardware and Electronics and Manufacturing
in India, in terms of output and employment, has the potential to grow manifolds, driven by its emergence in the global electronics manufacturing value chain.
In order to create a conducive environment for manufacture of high technology, capital intensive semiconductors and other high tech electronic products, attract global investments as well as bridge the viability gap due to lack of adequate infrastructure and ecosystem, Government of India has announced number of initiatives in the country. To this aspect, there is also a need to ensure availability of
trained human resources for this sector in order to sustain growth and to achieve the
target set for this sector.
Course Objective
PG Diploma in Electronics System Design and Manufacturing (ESDM) is offered to enable new Electronics graduates/post graduates or working engineers in electronic industries to specify, design, develop and test electronic products. This is offered to bridge the major gap in competencies required to design, manufacture and market Indian state-of-the art electronic products.
The focus of the proposed program will be state-of-the-art electronic products that are likely to be manufactured in medium and large volumes for Indian and Global markets such as automotive, medical, consumer, industrial, entertainment, aerospace and defense. The program will not emphasize complex products produced in small numbers or very complex systems (main frame computers, telephone exchanges, data centers etc.).
The representative product for consideration in this program include music systems, biomedical equipment, cell phones, laptops, PCs, tablets, set top boxes, TV sets, modems, instrumentation systems ,routers, controllers, RFID systems, smart card related equipment, UPS, power management systems. The program is also restricted to the design of products that are based on known technologies of manufacturing and available components
Course Outcome
On successful completion of the course the candidates are expected to have competency in the following
Electronic Circuit Design
Electronic Board and Enclosure Design,
Embedded Software & hardware development
FPGA based prototyping for reconfigurable computing
Industrial product Design,
Communication Protocols
platforms for Internet of Things (IoT)
Course Structure
The ESDM100 course contains nine modules. After completing the first eight modules, the students have to do a six weeks project towards the requirements for the award of PG Diploma in ESDM.
Material classification based on conductivity, basic Semi-conductor, Diodes, Characteristics of Diodes, Classification of Diodes, Transistors, Classification of Transistors, BJT characteristics, JFET & MOSFET Characteristics, Transistor Amplification Circuits, OP Amp, Basic Characteristics of OP Amp, Feedback circuits, Introductions to Digital circuits.
Fundamentals of circuit design
Basic circuit laws , Current & voltage division Rules, Introduction to Linear and Non-linear elements, Classification of sources, Equivalent Impedance Calculations in series & parallel circuits, Basic Network Theorems, Current, voltage and Power calculations in a circuit, Diode applications, Clipping and Clamping Circuits with Diodes, Rectifier Circuits, Transistors, Selection and analysis of Components, sensing devices and display devices.
Course Description
Evolution and Classification of Printed Circuit Boards, Challenges in Modern PCB Design and Manufacture, PCB fabrication methodologies(SSB, DSB and multilayer board), PCB design considerations/ design rules for analog, digital and power applications, Electromagnetic interference in electronic systems and its impact. Analysis of electronic circuit from noise emission point of view (both conducted and radiated emission) cross talk and reflection behavior of the circuit in time domain, Thermal management of electronic devices and systems.
Semiconductor Packages: Single chip packages or modules. (SCM) Commonly used packages and advanced packages; Materials in packages, Current trends in Packaging, Multichip modules (MCM)-types; System-in package (SIP); Packaging roadmaps; Hybrid circuits.Pipe and FIFOs, Shared memory, Sockets
Course Description
Introduction to ARM Processor architecture and programmer’s model, Overview of Cortex Architecture, Cortex M3 Register Set and Modes, Cortex M3 Processor Core, Data Path and Instruction Decoding, ARM Cortex M3 Development Environment, Assembler and Compiler, Linkers and Debuggers, ARM, Thumb & Thumb2 instructions, Mixing ARM & Thumb Instructions, Memory hierarchy, Memory Mapping, Cache.
Programming Concepts: – High level and low level languages, Compiler, Linker & Cross compilers, running, debugging and testing of programs, Measures of program performance, Program optimization techniques.
Programming using Assembly language, C Programming: Introduction, Data Types and storage classes, Controlling program flow, Arrays, Functions, Pointers, Arrays and Pointers, Pointer to Functions and advanced topics on Pointers, Structures and Unions, Preprocessor directives, File operations, bitwise operations, Typecasting.
Cortex M3 based controller architecture, Memory mapping, Cortex M3 Peripherals – RCC, GPIO, Timer, System timer, UARTs, LCD, ADC, Cortex M3 interrupt handling – NVIC. Application development on Cortex M3 controllers.
Course Description Operating System Concepts for Embedded Systems
Basic Operating System Concepts: Linux as Embedded OS, Comparison of Embedded OS, Embedded OS Tools and development, Discussion on Embedded OS Applications and products, System Calls, Linux Compiler options, Make. Internals of Linux OS: Process, Multithreading and Synchronization. Inter Process Communication: Pipe and FIFOs, Shared memory, Sockets.
Getting Linux on a device and Driver Development
Introduction to Linux Kernel source tree and compilation, Linux boot sequence, Building Kernel, Building Boot image, Linux Kernel modules and module programming, Linux Device drivers
RTOS Concepts
Introduction to Real-time systems and Embedded Real-time Systems, Discussion and Comparison of popular RTOS, Design Goals for Real-time software, Discussion on Embedded Real-time applications, Considerations for real-time programming, Task/Thread Creation and management, Inter Task/Process Communication Mechanisms, Semaphores, Message Passing, Pipes, Interrupts, Development Tools.
Porting
Building root file system, Kernel Compilation for ARM, Porting of Embedded OS on ARM.
Course Description
Introduction to FPGA, HDL Refresher, Introduction to modelling & Writing Simple Test Benches, FPGA Devices, Design Flows, Principles of Combinational Circuit Design, Principles of Sequential Circuit Design, Principles of FSM Design, Principles of RTL Design, Mixing Design Styles, HDL Coding for Synthesis, Designing Memories, Modeling of Microprocessors, Designing SoC based system, Designing Bus based systems, Interfacing peripherals with the SoC, Interrupt Mechanisms with Processor.
Course Description
Introduction to serial (wired and wireless) and parallel communication. Familiarization of Serial communication protocols: I2C, SPI Ethernet, USB, PCI and PCIe. TCP/IP communications model and functional properties of each one of the layers. Packet and file transfer using embedded web server which supports FTP/HTTP/ SMTP/ SNMP protocols.
Course Description
Fundamentals of Wireless Technologies
Evolution of Wireless Communication, RF fundamentals, Overview of Cellular Systems, 1st, 2nd, 3rd and 4th Generation Cellular Systems.
Network Devices and the Internet of Things:
The students can select hardware, software or system level projects. The project can be
implemented using any tools learned during the course. A total product or project can be selected.
English
Course Fees
General Category Applicants: Course Fee is Rs 60,000 + Service tax @ actual.
SC/ST Category Applicants: Course Fee is waived for SC/ST students. However they are required to remit refundable security deposit of Rs.6,900 which will be refunded only after successful completion of the course. This amount will be forfeited, if the student fails to complete the course successfully.
Eligibility
M.E/M.Tech/BE/B.Tech(ECE/EEE/AEI/CSE/IT/Biomedical/Medical Electronics, C&I, Mechatronics and allied branches) or BSc / M.Sc (Electronics/CS). Diploma students may also be considered. Graduates with appropriate experience and final year students# also may apply.
# Final year students have to include the copies of course completion certificate of their qualifying degree/ diploma or copies of the mark lists up to the last semester/ year. On the date of counseling/ admission, he/she must produce the originals of course completion certificate/ mark lists up to the last semester/year examination.
Important Dates
Last date for receiving completed
application forms
First selection list will be prepared based on the applications received on or before 01st August 2017. The additional selection list will be prepared based on the applications received on or before 08th August 2017, and excluding the applicants, included in the first selection list.
Publication of first selection list in our Website
01st August 2017
Last date for taking provisional
admission by paying the advance fees, for applicants in the first selection list
08th August 2017
Publication of additional selection list in our website (if there are vacant seats)
08th August 2017
Counseling date
21st August 2017
Class Commencement date
21st August 2017
Payment of first installment fees
21st August 2017
Payment of second installment fees
11th November 2017
More Details
For more details like How to Apply, Placement, Hostel, etc please see the Course Calendar
For further information if any, you may Contact the Course Coordinator: nanda@calicut.nielit.in , Ph: 9995427802 / 0495-2287266 Extn: 244/222
English
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