Module Duration: 2 Weeks

Course Description
Evolution and Classification of Printed Circuit Boards, Challenges in Modern PCB Design and Manufacture, PCB fabrication methodologies(SSB, DSB and multilayer board), PCB design considerations/ design rules for analog, digital and power applications, Electromagnetic interference in electronic systems and its impact. Analysis of electronic circuit from noise emission point of view (both conducted and radiated emission) cross talk and reflection behavior of the circuit in time domain, Thermal management of electronic devices and systems.

Semiconductor Packages: Single chip packages or modules. (SCM) Commonly used packages and advanced packages; Materials in packages, Current trends in Packaging, Multichip modules (MCM)-types; System-in package (SIP); Packaging roadmaps; Hybrid circuits.Pipe and FIFOs, Shared memory, Sockets