राष्ट्रीय इलेक्ट्रॉनिकी एवं सूचना प्रौद्योगिकी संस्थान ,कालीकट
National Institute of Electronics & Information Technology,Calicut
|Course||:||PD503:Certificate Course on Electronics Board design and Bring up|
|Starting Date||:||30 September,2019|
|Last Date To Apply||:||30 September,19|
Emergence of India as a global economy has opened up a huge demand for electronic products. National Policy on Electronics and Make in India initiative of Government of India has resulted in setting up of many industries in the Electronics sector and has led to a huge demand for trained man power in Electronics Board Design.
Certificate Course on Electronics Board design and Bring up is offered to bridge the major gap in competencies required to design state-of-the art PCB and electronics products.
On successful completion of the Course, the Participants shall be able to
This course consist of two modules. The modules are as follows:
PD 503 A: Electronics Board Design Basics (1 Week )
PD 503 B: Multilayer PCB Design(1 Week)
PD 503C : Introduction to High Speed Signalling (1 Week)
PD 503D : Semiconductor Packages (1 Week)
PD 503 A: Electronics Board Design Basics (1 Week)
Evolution and Classification of Printed Circuit Boards, Challenges in Morden PCB, Design and Manufacturing, PCB fabrication, methodologies(SSB, DSB and multilayer board), PCB design considerations/ design rules for analog, digital and power applications, Electromagnetic interference in electronic systems and its impact Analysis of electronic circuit from noise emission point of view (both conducted and radiated emission) cross talk and reflection behaviour of the circuit in time domain, Thermal management of electronic devices and systems.
PD 503 B: Multilayer PCB Design (1 Week)
Multilayer PCB design guide lines, Design of Multilayer PCB Stackup, Differential pair routing, Length matching, Generation of different types of reports.
PD 503 C: Introduction to High Speed Signalling (1 Week)
Introduction to high speed PCB design, Signal Integrity, Power Integrity and Thermal Analysis, Power distribution and noise, Signalling convention, termination
PD 503 D: Semiconductor Packages (1 Week)
Single chip packages or modules. (SCM) Commonly used packages and advanced packages; Materials in packages, Current trends in Packaging, Multichip modules (MCM) - types; System-in package (SIP); Packaging roadmaps; Hybrid circuits.
Rs 13090/- (Rs. 11,000/- + 18% GST + 1% KFC)
SC/ST Candidates: Tuition Fees are waived for SC/ST students admitted under SCSP/TSP. However they are required to remit an amount of Rs. 1000/- as Advance caution/security deposit
B.E./B.Tech in Electronics/ Electronics & Communication/ Electrical/ Electrical and Electronics/Instrumentation/ Biomedical /Computer Science/Information Technology or MSc in Electronics/ Instrumentation/ Computer Science/Information Technology or Diploma in Electronics/CS/IT/EEE/EI.
Publication/Intimation of selection list in our website: 30/09/2019*
Counseling Date: 30/09/2019
Class Commencement Date: 30/09/2019
* Those who have not received the selection information by email as on the dates mentioned may contact the course coordinator.
For more details like How to Apply, Placement, Hostel, etc please see the Course Calendar
For more Information Contact the course coordinator Ishant Kumar Bajpai, Scientist/Engineer ‘C’, Ishant@nielit.gov.in , Mobile: +91-7034797019, +919958016673