PD500:PG Diploma in Electronic Product Design and Manufacturing

Course	:	PG Diploma in Electronic Product Design and Manufacturing
Code	:	PD500
Starting Date	:	19 August,2019
Last Date To Apply	:	13 August,19
Course Coordinator	:	Mr. Ishant Kumar Bajpai, Scientist/Engineer ‘C’ Email: ishant@nielit.gov.in, Mobile: +91-7034797019/+91-9958016673

Course Preamble

Emergence of India as a global economy has opened up a huge demand for electronic products. National Policy on Electronics and Make in India initiative of Government of India has resulted in setting up of many industries in the Electronics Sector and has led to a huge demand for trained man power in Electronics System Design and Manufacture (ESDM).

Course Objective

To enable new electronics graduates/post graduates or working engineers in electronic industry; specify, design, develop and test electronic products. This course will bridge the major gap in competencies required to design, manufacture and market state-of-the art electronics products

Course Outcome

On successful completion of the Course, the Participants shall

• Be able to specify, Design, Develop and Test electronic Products.

• Get exposure to Industrial Design of Electronic Products

Course Structure

This course consist of nine modules including 6 months internship. After successful completion of first six modules (PD 901 to PD 906), Students will undergo a 6 months internship either at the associated industries of Maker Village or any other industry in electronic sector.

The modules are as follows:

PD 500	Module Name	Duration(Weeks)
PD 501	Industrial Design of Electronic Products	2
PD 502	Electronic  Circuit Design	3
PD 503	Electronic  board design and bring up	4
PD 504	Processor based System Design	5
PD 505	Networking & IOT	4
PD 506	Project Work	6

Course Contents

PD 501: Industrial Design of Electronic Products (2 Weeks)

• Product Development Process: Product Planning, Product requirements and specifications, Concept development, Product Architecture, Project Management
• Industrial Design: Aesthetic, Ergonomic, Manufacturing, Cost, Thermal, EMI/EMC,
• Quality and Testing: DFMA, DFT, Prototyping, Patents & IPR, Product Development Economics, Quality Concepts, QFD, ISO9000, Reliability, DFMEA, Standards, certifications, regulatory compliance testing and Documentation

   PD 502: Electronic Circuit Design (3 Weeks)

• Electronics Fundamentals: Material classification based on conductivity, basic Semi-conductor, Diodes, Characteristics of Diodes, Classification of Diodes, Transistors, Classification of Transistors, BJT characteristics, JFET & MOSFET Characteristics, Transistor Amplification Circuits, OP Amp, Basic Characteristics of OP Amp, Feedback circuits, Introductions to Digital circuits.
• Fundamentals of Circuit Design: Basic circuit laws , Current & voltage  division Rules, Introduction to Linear and Non-linear elements,  Classification of sources, Equivalent Impedance Calculations in series &  parallel circuits, Basic Network Theorems, Current, voltage and Power  calculations in a circuit, Diode applications, Clipping and Clamping Circuits  with Diodes, Rectifier Circuits, Transistors, Selection and analysis of  Components, sensing  devices  and display devices.
• Power Supply design: Introduction to low power design techniques and methodologies. Introduction to various types of power supplies. Estimation of power supply requirements and power loss in electronic products.  Selection of appropriate power supplies for the given primary power sources (230VAC/Battery). Design of power scheduler, power management unit of an electronic product.

PD: 503 Electronic Board Design and Bring up (4 Weeks)

• Evolution  and  Classification  of Printed Circuit Boards, Challenges in Morden PCB, Design and Manufacturing, PCB fabrication, methodologies(SSB, DSB and multilayer board), PCB design  considerations/ design rules for analog, digital and power applications,  Electromagnetic interference in electronic systems and its impact  Analysis of electronic circuit from noise emission point of view (both  conducted and radiated emission) cross talk and reflection behaviour of  the circuit in time domain, Thermal management of electronic devices  and systems.
• Semiconductor Packages: Single chip packages or modules. (SCM)  Commonly used packages and advanced packages; Materials in packages, Current trends in Packaging, Multichip modules (MCM) - types; System-in package (SIP); Packaging roadmaps; Hybrid circuits.
• Introduction to high speed PCB design, Signal Integrity, Power Integrity and Thermal Analysis, Power distribution and noise, Signalling convention, terminations,  Multilayer PCB design guide lines, Design of Multilayer PCB stackup, Differential pair routing, Length matching, Generation of different types of reports.

PD 504: Processor based System Design (5 Weeks)

• C Programming: Introduction, Data Types and storage classes, Operators, Control Statements, Arrays, Strings
• Cortex ARM: Introduction to ARM cortex Processor architecture and programmer's  model, Introduction to Processor Instruction Set Architecture,  Interrupt mechanisms and Exception handling, Cross compilation, Tool  chains and Development environments, Programming using Assembly, C  and Mixing the Assembly and C programming.
• Introduction to STM32 Cortex M3 hardware, Introduction to CMSIS, JTAG/ SWIM based debugging using ST-LINK/V2, Introduction to STM32 Cube MX graphical configuration and generating the code in KEIL / TrueStudio.
• Interfacing: switches, LCD, Keyboard, IO programming, etc. through  processor ports, Generating delays and PWM using timers, and  Watchdog mechanism, Working with PC and RS-232, Peripheral  interfacing through I2C,SPI etc, Interfacing with Memory, Providing  Reset and Clock on a board, Interacting with real world using ADC and  DAC.
• Mid Term Project: Students will be given 1 week to complete their midterm project.

PD 505: Networking & IOT (4 Weeks)

• Networking & Communication Technologies: Networking basics, Topologies and OSI model introduction, Transport Layer Protocols, Socket Programming, Packet Sniffing and analysis. Wifi – IEEE 802.11 standard, Wifi programming,  Bluetooth – Standard, BlueZ Stack, Bluetooth Programming, Zigbee –  Understanding Protocol, Target board programming with Zigbee,  Wireless Security Threats.
• IoT:  IoT Entities, IoT standards, IoT application development with embedded hardware.
• Mobile Programming Languages: Design & Development of Mobile User Interfaces, Mobile Application Development & Debugging, Customizing of Android Platform, Hardware Abstraction Layers, Android Framework
• Python: Introduction to Python, Basic Syntax, Data Types, Variables, Operators, Input/output, Flow of Control (Modules, Branching), Function and Methods, Dictionaries, Functions and Functional Programming, Object Oriented, OOPs concept, Class and object, Python Libraries
• Introduction to Image Processing: Introduction to Image Processing toolkit of MATLAB: Image Read/Write, Histogram Equalization, Smoothing, Filtering, thresholding, Edge Detection and Segmentation, Image processing in Open CV, Features detection and description and Video Analysis

PD 506: Project (6 Weeks)

Done as a group project where the trainees will be working on a real life  problem sourced from industry/ start-ups and developing a complete  product; right from identifying customer requirements and translating  them into product specifications and realization of the product  specifications through electronic, mechanical and industrial design  within the cost and time constraints.

Course Fees

General Candidates: Course fee is Rs. 50,000/- + GST at actuals

SC/ST Candidates: Tuition Fees are waived for SC/ST students admitted under SCSP/TSP. However they are required to remit an amount of Rs. 8500/- as Advance caution/security deposit.

Eligibility

M.E/M.Tech/BE/B.Tech(ECE/EEE/AEI/CSE/ IT/Mechatronics/Biomedical and allied branches)
Or
M.Sc (Electronics/CS and allied branches).

Important Dates

Last date for receiving completed application forms : 07.08.2019. 
Publication of first selection list in the Website :   07.08.2019
Last date for taking provisional admission by paying the advance fees (for applicants in the first selection list) 12.08.2019
Publication of additional selection list in our website (if there are vacant seats) 13.08.2019
Counseling date 19.08.2019
Class Commencement date 19.08.2019
Payment of first installment fee 19.08.2019
Payment of second installment fee 18.10.2019

More Details

For more details like How to Apply, Placement, Hostel, etc please see the Course Calendar 

For more Information Contact the course coordinator   Ishant Kumar Bajpai, Scientist/Engineer ‘C’,  Ishant@nielit.gov.in , Ph: +91-9400398613 / 0495-2287266 Extn: 225